Cov yam ntxwv thiab kev lag luam tseem ceeb ntawm Electronic Glass

Raws li cov khoom siv tseem ceeb rau kev lag luam optoelectronic niaj hnub no, iav hluav taws xob ua lub luag haujlwm tsis tuaj yeem hloov pauv hauv cov lus qhia, touchscreens, thiab kho qhov muag pom vim nws cov qauv tsim tshwj xeeb thiab kev ua tau zoo. Nws cov yam ntxwv tseem ceeb yog cov teeb pom kev zoo siab, zoo heev nto flatness, zoo mechanical thiab thermal stability, thiab customizability. Cov yam ntxwv no sib sau ua nws daim ntawv thov teeb meem hauv kev tsim khoom siab - kawg.

High light transmittance yog thawj technical feature ntawm hluav taws xob iav. Los ntawm kev ua tib zoo xaiv siab - purity raw cov ntaub ntawv thiab nruj me ntsis tswj cov ntsiab lus ntawm kev hloov hlau impurities, qhov transmittance nyob rau hauv lub teeb pom kev zoo tuaj yeem ncav cuag ntau dua 90%, ua tau raws li qhov yuav tsum tau muaj qhov ci ntsa iab, qhov sib txawv siab, thiab kev kuaj pom tseeb. Hauv siab - cov khoom kawg, kev ruaj ntseg kev xa mus yog tswj hwm thoob plaws cov khoom sib txawv thiab kev siv ib puag ncig. Qhov no tso siab rau kev tswj xyuas qhov kub thiab txias thaum lub sij hawm raw khoom homogenization thiab melting txheej txheem los xyuas kom meej qhov zoo sib xws thiab rov ua haujlwm kho qhov muag.

Nto flatness thiab thickness uniformity yog lwm tus yam ntxwv tseem ceeb. Electronic iav feem ntau yog siv los ua substrate rau micron - rau submicron - theem pixel qauv. Nto undulations yuav tsum tau tswj nyob rau hauv lub nanometer ntau yam kom tsis txhob imaging distortion los yog touchscreen drift. Float iav, overflow rub-down, thiab slot rub-down technologies siv nyob rau hauv cov txheej txheem molding optimize ndlwg thiab txias tej yam kev mob, ua tiav thickness kam rau ua nyob rau hauv ± 1 micrometers rau loj - cheeb tsam, ultra{9}} nyias iav. Qhov no muab lub hauv paus geometric rau siab - cov lus qhia ceev thiab qhov ntsuas qhov tseeb.

Mechanical thiab thermal stability kom txhim khu kev qha kev lag luam nyob rau hauv complex tej yam kev mob. Cov iav hluav taws xob muaj lub siab elastic modulus thiab lub zog flexural, thaum nws coefficient ntawm thermal expansion tuaj yeem hloov kho nrog cov qauv, tswj kev ruaj ntseg ntawm qhov sib txawv ntawm qhov kub thiab txias. Kev taw qhia txog cov ntsiab lus tsis tshua muaj hauv ntiaj teb lossis cov oxides tshwj xeeb hauv qee cov khoom lag luam inhibits thermal stress cracking, ncua kev pab cuam lub neej nyob rau hauv ib puag ncig uas muaj kub variations, xws li tsheb thiab sab nraum zoov ib puag ncig.

Functional customization yog ib qho txiaj ntsig txuas ntxiv ntawm cov iav hluav taws xob. Siv cov txheej txheem txheej txheej thiab ion doping thev naus laus zis, cov txheej txheem ua haujlwm sib xyaw xws li cov txheej txheem pob tshab, tiv thaiv - cov txheej txheem rov qab, thiab tiv thaiv - txheej ntiv tes tuaj yeem tsim los ntawm iav, muab nws kov qhov muag, qhov muag - tiv thaiv kev tiv thaiv - pom kev, thiab yooj yim {{6}. Qhov kev sib xyaw ua ke tsim no txo ​​cov naj npawb ntawm cov txheej txheem txheej txheej, ua rau kev txhim kho tag nrho cov thinness thiab kev ntseeg tau.

Tsis tas li ntawd, kev ua txhaum ntawm kev hloov pauv ntawm cov iav hluav taws xob tau nthuav dav nws daim ntawv thov ciam teb. Los ntawm kev sib xyaw ua ke qis - melting- cov ntsiab lus cov khoom nrog precision molding, hloov tau yooj yim substrates uas tuaj yeem rov khoov duav thiab tsis tshua muaj cov creases tuaj yeem tsim tau, muab cov khoom txhawb nqa rau cov ntaub ntawv tshiab xws li cov ntxaij vab tshaus thiab cov khoom siv hnav.

Zuag qhia tag nrho, cov yam ntxwv ntawm cov iav hluav taws xob ua ke nrog kev ua tiav ntawm cov ntaub ntawv tshawb fawb, txheej txheem engineering, thiab kev tsim qauv. Nws tsis tsuas yog ua tau raws li qhov kev ua tau zoo thiab qhov loj me ntawm cov khoom siab tam sim no -kawg optoelectronic cov khoom tab sis tseem ua rau lub hauv paus ruaj khov rau yav tom ntej evolution ntawm cov zaub thiab kev paub technologies.